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Delay By Connect, also called DeLay, is a delay algorithm used to connect two or more digital circuit and it is the opposite of Delay By Drip (also called DbD. It is an example of a connection algorithm that allows the use of a signal trace without connecting all its pins. Delay By Connect is a technique that minimizes the required wirelength to connect two or more digital circuits. As such it is one of many wire-length optimization techniques used by digital-circuit designers. The Delay By Connect method was introduced by C. H. Chen and L. P. Kao in 1973.
Drip is a technique for reducing the length of wires and hence the delay and power consumption in a large circuit or network, such as a processor chip. Drip uses delay lines which are rather like buffers, but with carefully contrpled time constants to “drip” data between points, allowing shorter wires than might be possible by just using buffering. A drip line can be viewed as a combination of a series of flip-flops, where the output of each stage is connected to the input of the next stage via a capacitive load. This is known as a cascade connection. The time constant of the delay line is determined by the product of the capacitance and resistance of the line.
Integrating Delay By Connect with Drip is important because it will reduce the number of wiring needed for complex integrated circuits. It will also decrease the average distance between transistors by decreasing the number of wires that pass through the silicon substrate. Furthermore, it will decrease the mean time to failure (MTTF. due to its reliability; it has been proven that Delay By Connect can be implemented with low risk of failure. It will also improve the probability of defect-free processing due to its effectiveness in avoiding defects during fabrication. Moreover, it will decrease the cost because fewer process steps are required to manufacture complex integrated circuits. Finally, integrating Delay By Connect with Drip will decrease the power consumption by using less power supply vptage on critical nodes.
The integration of Delay By Connect with Drip will have several benefits to companies that produce electronics. It will decrease the area requirement on chip layout because fewer wires are needed for connections between components within an integrated circuit. It will also increase the MTTF because longer wires are more likely to fail due to manufacturing defects than shorter wires. Additionally, it will lower manufacturing costs because fewer process steps are required during manufacturing. Finally, it decreases power consumption because less power supply vptage is used on critical nodes within an integrated circuit.
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